embedded die packaging technology market
100 Pages | ICT & Semiconductor

Global Embedded Die Packaging Technology Market Insights 2023, Analysis and Forecast to 2030, By Platform, By Industry Vertical

  • Published Date : 20-07-2023
  • Pages : 100
  • Report Id : 40258
  • Categories : ICT & Semiconductor

This report describes the global market size of Embedded Die Packaging Technology Market from 2018 to 2021 and its CAGR from 2018 to 2021, and also forecasts its market size to the end of 2030 and its expected to grow with a CAGR of 17.5% from 2023 to 2030.

A native 3D-compatible packaging method is embedded die packaging technology.

Due to the COVID-19 pandemic and Russia-Ukraine War Influence, the global market for Embedded Die Packaging Technology Market estimated at US $ million in the year 2022, is projected to reach a revised size of US$ million by 2030, growing at a CAGR of 17.5% during the forecast period 2023-2030. North American market for Embedded Die Packaging Technology Market is estimated to increase from $million in 2022 to reach $ million by 2030, at a CAGR of % during the forecast period of 2023 through 2030.


For geography segment, regional supply, demand, major players, price is presented from 2018 to 2030. This report cover following regions:
North America
Asia-Pacific
Europe
Middle East and Africa
South America


The key countries for each regions are also included such as United States, China, Japan, India, Korea, ASEAN, Germany, France, UK, Italy, Spain, CIS, and Brazil etc.

For competitor segment, the report include global key players of Embedded Die Packaging Technology Market as well as some small players. The information for each competitor include:
Company Profile
Main Business Information
SWOT Analysis
Sales Volume, Revenue, Price and Gross Margin
Market Share

By Platform
Embedded Die in IC Package Substrate
Embedded Die in Rigid Board
Embedded Die in Flexible Board

It is divided into embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board categories based on platform. The embedded die in IC package substrate category was the largest contributor to the market in 2021, according to a market study of embedded die packaging technology; however, embedded die in flexible board is anticipated to grow more quickly over the course of the forecast period.

By Industry Vertical
Consumer Electronics
IT and Telecommunication
Automotive
Healthcare
Others

On the basis of industry vertical, the market is segmented into consumer electronics, IT and telecommunication, automotive, healthcare, and others. The consumer electronics and IT & telecommunication segments collectively accounted for majority of the embedded die packaging technology market share in 2021. Surge in prime players initiatives to develop and deploy next generation portable devices solution globally has led the growth of the consumer electronics and IT & telecommunication segment; thereby, enhancing the embedded die packaging technology market growth. Meanwhile, the others segment is estimated to grow at a faster rate during the forecast period.

By Region
North America
APAC
Europe
South America
Middle East & Africa

Region-wise, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA. Asia-Pacific holds a significant share in the global embedded die packaging technology market size, owing to the presence of prime players in this region, and it is also expected to be the faster growing region during the forecast period. Further, China holds a dominating position in the Asia-Pacific embedded die packaging technology market forecast owing to rise in investment by prime players and government agencies to develop next generation embedded die packaging technology-based semiconductor solution to improve electrical thermal performance and reliability & mechanical stability, which is expected to lead to the growth of the embedded die packaging technology in this region.

By Company
Amkor Technology Inc.
ASE GROUP
Fujikura
General Electric
Microsemi
SCHWEIZER ELECTRONIC AG
Taiwan Semiconductor Manufacturing Company Limited
AT&S Group
Infenion Technologies AG
TDK Corporation

Please ask for sample pages for full companies list

Base Year: 2022
Historical Data: from 2018 to 2021
Forecast Data: from 2023 to 2030

Any special requirements about this report, please let us know and we can provide custom report.


TABLE OF CONTENTS
1 REPORT OVERVIEW
1.1 MARKET INTRODUCTION
1.2 KEY MARKET SEGMENTS
1.3 PLAYERS COVERED
1.4 MARKET ANALYSIS BY Platform
1.4.1 Global Embedded Die Packaging Platform Market Size Growth Rate by Platform (2018-2030)
1.5 MARKET BY Industry Vertical
1.5.1 Global Embedded Die Packaging Platform Market Share by Industry Vertical (2018-2030)
1.6 STUDY OBJECTIVES
1.7 YEARS CONSIDERED
2 GLOBAL GROWTH TRENDS
2.1 GLOBAL Embedded Die Packaging Platform MARKET SIZE
2.2 REGULATORY FRAMEWORK
2.3 IMPACT OF COVID-19
2.4 RUSSIA-UKRAINE CRISIS IMPLICATIONS
2.5 INDUSTRY TRENDS
2.5.1 Market Top Trends
2.5.2 Market Drivers
2.5.3 Market Restraints
2.5.4 Market Opportunities
2.5.5 Porter�s Five Forces Analysis
2.5.6 PESTLE Analysis
2.5.7 SWOT Analysis
2.5.8 Opportunity Orbit
2.5.9 Platform Roadmap
2.5.10 Go to Market Strategy
3 ANALYSIS OF DATA BY Platform AND Industry Vertical
3.1 GLOBAL Embedded Die Packaging Platform MARKET SIZE BY Platform (2018-2030)
3.2 GLOBAL Embedded Die Packaging Platform MARKET SIZE BY Industry Vertical (2018-2030)
4 NORTH AMERICA
4.1 NORTH AMERICA Embedded Die Packaging Platform MARKET (2018-2030)
4.2 NORTH AMERICA Embedded Die Packaging Platform MARKET SIZE BY Platform
4.3 NORTH AMERICA Embedded Die Packaging Platform MARKET SIZE BY Industry Vertical
4.4 NORTH AMERICA Embedded Die Packaging Platform MARKET SIZE BY COUNTRY
5 EUROPE
5.1 EUROPE Embedded Die Packaging Platform MARKET (2018-2030)
5.2 EUROPE Embedded Die Packaging Platform MARKET SIZE BY Platform
5.3 EUROPE Embedded Die Packaging Platform MARKET SIZE BY Industry Vertical
5.4 EUROPE Embedded Die Packaging Platform MARKET SIZE BY COUNTRY
6 ASIA PACIFIC
6.1 ASIA PACIFIC Embedded Die Packaging Platform MARKET (2018-2030)
6.2 ASIA PACIFIC Embedded Die Packaging Platform MARKET SIZE BY Platform
6.3 ASIA PACIFIC Embedded Die Packaging Platform MARKET SIZE BY Industry Vertical
6.4 ASIA PACIFIC Embedded Die Packaging Platform MARKET SIZE BY COUNTRY
7 SOUTH AMERICA
7.1 SOUTH AMERICA Embedded Die Packaging Platform MARKET (2018-2030)
7.2 SOUTH AMERICA Embedded Die Packaging Platform MARKET SIZE BY Platform
7.3 SOUTH AMERICA Embedded Die Packaging Platform MARKET SIZE BY Industry Vertical
7.4 SOUTH AMERICA Embedded Die Packaging Platform MARKET SIZE BY COUNTRY
8 MIDDLE-EAST & AFRICA
8.1 MIDDLE-EAST & AFRICA Embedded Die Packaging Platform MARKET (2018-2030)
8.2 MIDDLE-EAST & AFRICA Embedded Die Packaging Platform MARKET SIZE BY Platform
8.3 MIDDLE-EAST & AFRICA Embedded Die Packaging Platform MARKET SIZE BY Industry Vertical
8.4 MIDDLE-EAST AFRICA Embedded Die Packaging Platform MARKET SIZE BY COUNTRY
9 KEY PLAYERS PROFILES
9.1 Amkor Technology Inc.
9.1.1 Company Details
9.1.2 Business Overview
9.1.3 Products & Services
9.1.4 Financial Overview (2018-2030)
9.1.5 Recent Development
9.2 ASE GROUP
9.2.1 Company Details
9.2.2 Business Overview
9.2.3 Products & Services
9.2.4 Financial Overview (2018-2030)
9.2.5 Recent Development
9.3 Fujikura
9.3.1 Company Details
9.3.2 Business Overview
9.3.3 Products & Services
9.3.4 Financial Overview (2018-2030)
9.3.5 Recent Development
9.4 General Electric
9.5 Microsemi
9.6 SCHWEIZER ELECTRONIC AG
9.7 Taiwan Semiconductor Manufacturing Company Limited
9.8 AT&S Group
9.9 Infenion Technologies AG
9.10 TDK Corporation
10 MARKET SHARE BY KEY PLAYERS
10.1 Embedded Die Packaging Platform MARKET SIZE BY PLAYERS
10.1.1 Global Embedded Die Packaging Platform Revenue by Players (2021)
10.1.2 Global Embedded Die Packaging Platform Revenue Market Share by Players (2021)
10.2 MOST ADOPTED STRATEGIES
10.3 MOST ACTIVE COMPANIES
10.4 MARKET COMPETITION ANALYSIS
11 APPENDIX
11.1 RESEARCH METHODOLOGY
11.2 PRIMARY RESEARCH
11.3 SECONDARY RESEARCH
11.4 DISCLAIMER

LIST OF TABLES
Table 1. Embedded Die Packaging Platform Key Players Covered in 2021
Table 2. Global Embedded Die Packaging Platform Market Size Growth Rate by Platform (2018-2030) (Million US$)
Table 3. Global Embedded Die Packaging Platform Market Size Growth by Industry Vertical (2018-2030) (Million US$)
Table 4. Key Trends
Table 5. Key Drivers: Impact Analysis (2018-2030)
Table 6. Key Restraints
Table 7. Global Embedded Die Packaging Platform Market Size by Platform (2018-2030) (Million US$)
Table 8. Global Embedded Die Packaging Platform Market Size Share by Platform (2018-2030)
Table 9. Global Embedded Die Packaging Platform Market Size Share by Industry Vertical (2018-2030)
Table 10. North America Embedded Die Packaging Platform Market Size Share by Platform (2018-2030)
Table 11. North America Embedded Die Packaging Platform Market Size by Industry Vertical (2018-2030) (Million US$)
Table 12. North America Embedded Die Packaging Platform Market Size Share by Industry Vertical (2018-2030)
Table 13. North America Embedded Die Packaging Platform Market Size by country (2018-2030) (Million US$)
Table 14. North America Embedded Die Packaging Platform Market Share by country (2018-2030)
Table 15. By Country
Table 16. Europe Embedded Die Packaging Platform Market Size by Platform (2018-2030) (Million US$)
Table 17. Europe Embedded Die Packaging Platform Market Share by Platform (2018-2030)
Table 18. Europe Embedded Die Packaging Platform Market Size by Industry Vertical (2018-2030) (Million US$)
Table 19. Europe Embedded Die Packaging Platform Market Share by Industry Vertical (2018-2030)
Table 20. Europe Embedded Die Packaging Platform Market Size by country (2018-2030) (Million US$)
Table 21. Europe Embedded Die Packaging Platform Market share by country (2018-2030)
Table 22. Asia Pacific Embedded Die Packaging Platform Market Size by Platform (2018-2030) (Million US$)
Table 23. Asia Pacific Embedded Die Packaging Platform Market Share by Platform (2018-2030)
Table 24. Asia Pacific Embedded Die Packaging Platform Market Size by Industry Vertical (2018-2030) (Million US$)
Table 25. Asia Pacific Embedded Die Packaging Platform Market Share by Industry Vertical (2018-2030)
Table 26. APAC Embedded Die Packaging Platform Market Size by country (2018-2030) (Million US$)
Table 27. APAC Embedded Die Packaging Platform Market share by country (2018-2030)
Table 28. South America Embedded Die Packaging Platform Market Size by Platform (2018-2030) (Million US$)
Table 29. South America Embedded Die Packaging Platform Market Share by Platform (2018-2030)
Table 30. South America Embedded Die Packaging Platform Market Size by Industry Vertical (2018-2030) (Million US$)
Table 31. South America Embedded Die Packaging Platform Market Share by Industry Vertical (2018-2030)
Table 32. South America Embedded Die Packaging Platform Market Size by country (2018-2030) (Million US$)
Table 33. South America Embedded Die Packaging Platform Market share by country (2018-2030)
Table 34. The Middle-East & Africa Embedded Die Packaging Platform Market Size by Platform (2018-2030) (Million US$)
Table 35. The Middle-East & Africa Embedded Die Packaging Platform Market Share by Platform (2018-2030)
Table 36. The Middle-East & Africa Embedded Die Packaging Platform Market Size by Industry Vertical (2018-2030) (Million US$)
Table 37. The Middle-East & Africa Embedded Die Packaging Platform Market Share by Industry Vertical (2018-2030)
Table 38. The MEA Embedded Die Packaging Platform Market Size by country (2018-2030) (Million US$)
Table 39. The MEA Embedded Die Packaging Platform Market share by country (2018-2030)
Table 40. Amkor Technology Inc. Details
Table 41. Business Overview
Table 42. Products & services
Table 43. Financial Overview (2018-2030) (Million US$)
Table 44. Recent Development
Table 45. ASE GROUP Details
Table 46. Business Overview
Table 47. Products & services
Table 48. Financial Overview (2018-2030) (Million US$)
Table 49. Recent Development
Table 50. Fujikura Company Details
Table 51. Business Overview
Table 52. Products & services
Table 53. Financial Overview (2018-2030) (Million US$)
Table 54. Recent Development
Table 55. Global Embedded Die Packaging Platform Revenue by Players (2021) (Million US$)
Table 56. Global Embedded Die Packaging Platform Market Share by Players (2021)

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LIST OF FIGURES

Figure 1. Global Embedded Die Packaging Platform Market Share by Platform in 2021 & 2028
Figure 2. Global Embedded Die Packaging Platform Market Share by Industry Vertical in 2021 & 2028
Figure 3. Embedded Die Packaging Platform Report Years Considered
Figure 4. Global Embedded Die Packaging Platform Market Size and Growth Rate 2018-2030 (Million US$)
Figure 5. Porter's Five Forces Analysis
Figure 6. Global Embedded Die Packaging Platform Market Size by Platform Growth Rate 2018-2030 (Million US$)
Figure 7. Global Embedded Die Packaging Platform Market Size by Industry Vertical Growth Rate 2018-2030 (Million US$)
Figure 8. North America Embedded Die Packaging Platform Market Size 2018-2030 (Million US$)
Figure 9. Europe Embedded Die Packaging Platform Market Size 2018-2030 (Million US$)
Figure 10. Asia Pacific Embedded Die Packaging Platform Market Size 2018-2030 (Million US$)
Figure 11. South America Embedded Die Packaging Platform Market Size 2018-2030 (Million US$)
Figure 12. The Middle-East & Africa Embedded Die Packaging Platform Market Size 2018-2030 (Million US$)
Figure 1. Amkor Technology Inc. Revenue in (2019-2021)
Figure 2. Revenue Growth Rate (2018-2030)
Figure 3. Revenue Growth Rate in (2018-2030)
Figure 4. Global Embedded Die Packaging Platform Market Share by Players in 2021

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