Global Thin Wafer Processing and Dicing Equipment Market Insights 2023, Analysis and Forecast to 2030, By Equipment Type, Application, Wafer Type, Dicing Technology, Wafer Thickness

  • Published Date : 14-09-2023
  • Pages : 100
  • Report Id : 40302
  • Categories : ICT & Semiconductor

This report describes the global market size of Thin Wafer Processing and Dicing Equipment Market from 2018 to 2022 and its CAGR from 2018 to 2022, and also forecasts its market size to the end of 2030 and its expected to grow with a CAGR of 15.3% from 2023 to 2030.

Thin wafer processing and dicing equipment is a Equipment Type of semiconductor manufacturing equipment that is used to process and dice thin wafers. Thin wafers are typically used for applications where size and weight are important, such as in mobile devices and wearable electronics.

Thin wafer processing and dicing equipment typically includes the following components:
Wafer thinning equipment: This equipment is used to reduce the thickness of the wafer. This is done by removing material from the back of the wafer.
Wafer polishing equipment: This equipment is used to smooth the surface of the wafer after it has been thinned. This is important to ensure that the wafer is flat and free of defects.
Dicing equipment: This equipment is used to cut the wafer into individual chips. This is done by using a blade or laser to create a series of cuts in the wafer.

Due to the COVID-19 pandemic and Russia-Ukraine War Influence, the global market for Thin Wafer Processing and Dicing Equipment Market estimated at US $ million in the year 2022, is projected to reach a revised size of US$ million by 2030, growing at a CAGR of 15.3% during the forecast period 2023-2030. North American market for Thin Wafer Processing and Dicing Equipment Market is estimated to increase from $million in 2022 to reach $ million by 2030, at a CAGR of XX% during the forecast period of 2023 through 2030.


For geography segment, regional supply, demand, major players, price is presented from 2018 to 2030. This report cover following regions:
North America
Asia-Pacific
Europe
Middle East and Africa
South America

The key countries for each regions are also included such as United States, China, Japan, India, Korea, ASEAN, Germany, France, UK, Italy, Spain, CIS, and Brazil etc.

For competitor segment, the report include global key players of Thin Wafer Processing and Dicing Equipment Market as well as some small players. The information for each competitor include:
Company Profile
Main Business Information
SWOT Analysis
Sales Volume, Revenue, Price and Gross Margin
Market Share

By Equipment Type
Thinning Equipment
Dicing Equipment

Categorized by the type of equipment, the market is segmented into thinning equipment and dicing equipment. Within this classification, the dicing equipment segment emerged as the foremost source of revenue for the market throughout the forecast period.

By Application
Memory and Logic
MEMS Devices
CMOS Image Sensors
Power Devices
RFID

The market is divided into memory and logic segments based on application. Micro Electro Mechanical Systems (MEMS) devices, power devices, CMOS image sensors, and Radio Frequency Identification (RFID) devices are all accessible via Silicon Via (TSV). Within these applications, the memory and logic segment held the predominant position as the primary revenue contributor within the thin wafer processing and dicing equipment market forecast.

BY Wafer Size
Less than 4 inch
5 inch and 6 inch
8 inch
12 inch
Categorized by wafer size, the market is segmented into sizes below 4-inch, 5-inch, 6-inch, 8-inch, and 12-inch. Among these, the 5-inch and 6-inch segments stood out as the primary sources of revenue in the analysis of the thin wafer processing and dicing equipment market.

By Dicing Technology
Blade Dicing
Laser Dicing
Plasma Dicing
Stealth Dicing

Categorized by Dicing Technology, the market is segmented into Blade Dicing, Laser Dicing, Plasma Dicing, Stealth Dicing. Among these, the Blade Dicing segment stood out as the primary sources of revenue in the analysis of the thin wafer processing and dicing equipment market

By Wafer Thickness
750 micrometers
120 micrometers
50 micrometers

Categorized by Wafer Thickness, the market is segmented into 750 micrometers, 120 micrometers, 50 micrometers. Among these, 750 micrometers segment stood out as the primary sources of revenue in the analysis of the thin wafer processing and dicing equipment market

By Region
North America
APAC
Europe
South America
Middle East & Africa

In terms of geographical distribution, the analysis of trends in the thin wafer processing and dicing equipment market encompasses North America (including the U.S., Canada, and Mexico), Europe (encompassing the UK, Germany, France, and the broader European region), Asia-Pacific (encompassing China, Japan, India, South Korea, and other parts of the Asia-Pacific area), and LAMEA (covering Latin America, the Middle East, and Africa). Notably, the Asia-Pacific region, particularly the remaining areas of Asia-Pacific, maintains a significant role as a participant in the global thin wafer processing and dicing equipment industry.

By Company
EV Group
UTAC Holding
SPTS Technologies Ltd
Neon Tech ltd
Synova SA
Plasma-Therm
Disco Corporation
Lam Research Corp
Panasonic
Suzhou Delphi Laser Co.ltd
Other Key players

Please ask for sample pages for full companies list

Base Year: 2022
Historical Data: from 2018 to 2021
Forecast Data: from 2023 to 2030

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TABLE OF CONTENTS
1 REPORT OVERVIEW
1.1 MARKET INTRODUCTION
1.2 KEY MARKET SEGMENTS
1.3 PLAYERS COVERED
1.4 MARKET ANALYSIS BY Equipment Type
1.4.1 Global Thin Wafer Processing and Dicing Equipment Market Size Growth Rate by Equipment Type (2018-2030)
1.5 MARKET BY Application
1.5.1 Global Thin Wafer Processing and Dicing Equipment Market Share by Application (2018-2030)
1.6 STUDY OBJECTIVES
1.7 YEARS CONSIDERED
2 GLOBAL GROWTH TRENDS
2.1 GLOBAL Thin Wafer Processing and Dicing Equipment MARKET SIZE
2.2 REGULATORY FRAMEWORK
2.3 IMPACT OF COVID-19
2.4 RUSSIA-UKRAINE CRISIS IMPLICATIONS
2.5 INDUSTRY TRENDS
2.5.1 Market Top Trends
2.5.2 Market Drivers
2.5.3 Market Restraints
2.5.4 Market Opportunities
2.5.5 Porterís Five Forces Analysis
2.5.6 PESTLE Analysis
2.5.7 SWOT Analysis
2.5.8 Opportunity Orbit
2.5.9 Equipment Type Roadmap
2.5.10 Go to Market Strategy
3 ANALYSIS OF DATA BY Equipment Type AND Application
3.1 GLOBAL Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Equipment Type (2018-2030)
3.2 GLOBAL Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Application (2018-2030)
4 NORTH AMERICA
4.1 NORTH AMERICA Thin Wafer Processing and Dicing Equipment MARKET (2018-2030)
4.2 NORTH AMERICA Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Equipment Type
4.3 NORTH AMERICA Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Application
4.4 NORTH AMERICA Thin Wafer Processing and Dicing Equipment MARKET SIZE BY COUNTRY
5 EUROPE
5.1 EUROPE Thin Wafer Processing and Dicing Equipment MARKET (2018-2030)
5.2 EUROPE Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Equipment Type
5.3 EUROPE Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Application
5.4 EUROPE Thin Wafer Processing and Dicing Equipment MARKET SIZE BY COUNTRY
6 ASIA PACIFIC
6.1 ASIA PACIFIC Thin Wafer Processing and Dicing Equipment MARKET (2018-2030)
6.2 ASIA PACIFIC Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Equipment Type
6.3 ASIA PACIFIC Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Application
6.4 ASIA PACIFIC Thin Wafer Processing and Dicing Equipment MARKET SIZE BY COUNTRY
7 SOUTH AMERICA
7.1 SOUTH AMERICA Thin Wafer Processing and Dicing Equipment MARKET (2018-2030)
7.2 SOUTH AMERICA Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Equipment Type
7.3 SOUTH AMERICA Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Application
7.4 SOUTH AMERICA Thin Wafer Processing and Dicing Equipment MARKET SIZE BY COUNTRY
8 MIDDLE-EAST & AFRICA
8.1 MIDDLE-EAST & AFRICA Thin Wafer Processing and Dicing Equipment MARKET (2018-2030)
8.2 MIDDLE-EAST & AFRICA Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Equipment Type
8.3 MIDDLE-EAST & AFRICA Thin Wafer Processing and Dicing Equipment MARKET SIZE BY Application
8.4 MIDDLE-EAST AFRICA Thin Wafer Processing and Dicing Equipment MARKET SIZE BY COUNTRY
9 KEY PLAYERS PROFILES
9.1 EV Group
9.1.1 Company Details
9.1.2 Business Overview
9.1.3 Equipment Types & Services
9.1.4 Financial Overview (2018-2030)
9.1.5 Recent Development
9.2 UTAC Holding
9.2.1 Company Details
9.2.2 Business Overview
9.2.3 Equipment Types & Services
9.2.4 Financial Overview (2018-2030)
9.2.5 Recent Development
9.3 SPTS Technologies Ltd
9.3.1 Company Details
9.3.2 Business Overview
9.3.3 Equipment Types & Services
9.3.4 Financial Overview (2018-2030)
9.3.5 Recent Development
9.4 Neon Tech ltd
9.5 Synova SA
9.6 Plasma-Therm
9.7 COMPANY 7*
9.8 COMPANY 8*
9.9 COMPANY 9*
9.10 COMPANY 10*
10 MARKET SHARE BY KEY PLAYERS
10.1 Thin Wafer Processing and Dicing Equipment MARKET SIZE BY PLAYERS
10.1.1 Global Thin Wafer Processing and Dicing Equipment Revenue by Players (2021)
10.1.2 Global Thin Wafer Processing and Dicing Equipment Revenue Market Share by Players (2021)
10.2 MOST ADOPTED STRATEGIES
10.3 MOST ACTIVE COMPANIES
10.4 MARKET COMPETITION ANALYSIS
11 APPENDIX
11.1 RESEARCH METHODOLOGY
11.2 PRIMARY RESEARCH
11.3 SECONDARY RESEARCH
11.4 DISCLAIMER

LIST OF TABLES
Table 1. Thin Wafer Processing and Dicing Equipment Key Players Covered in 2021
Table 2. Global Thin Wafer Processing and Dicing Equipment Market Size Growth Rate by Equipment Type (2018-2030) (Million US$)
Table 3. Global Thin Wafer Processing and Dicing Equipment Market Size Growth by Application (2018-2030) (Million US$)
Table 4. Key Trends
Table 5. Key Drivers: Impact Analysis (2018-2030)
Table 6. Key Restraints
Table 7. Global Thin Wafer Processing and Dicing Equipment Market Size by Equipment Type (2018-2030) (Million US$)
Table 8. Global Thin Wafer Processing and Dicing Equipment Market Size Share by Equipment Type (2018-2030)
Table 9. Global Thin Wafer Processing and Dicing Equipment Market Size Share by Application (2018-2030)
Table 10. North America Thin Wafer Processing and Dicing Equipment Market Size Share by Equipment Type (2018-2030)
Table 11. North America Thin Wafer Processing and Dicing Equipment Market Size by Application (2018-2030) (Million US$)
Table 12. North America Thin Wafer Processing and Dicing Equipment Market Size Share by Application (2018-2030)
Table 13. North America Thin Wafer Processing and Dicing Equipment Market Size by country (2018-2030) (Million US$)
Table 14. North America Thin Wafer Processing and Dicing Equipment Market Share by country (2018-2030)
Table 15. By Country
Table 16. Europe Thin Wafer Processing and Dicing Equipment Market Size by Equipment Type (2018-2030) (Million US$)
Table 17. Europe Thin Wafer Processing and Dicing Equipment Market Share by Equipment Type (2018-2030)
Table 18. Europe Thin Wafer Processing and Dicing Equipment Market Size by Application (2018-2030) (Million US$)
Table 19. Europe Thin Wafer Processing and Dicing Equipment Market Share by Application (2018-2030)
Table 20. Europe Thin Wafer Processing and Dicing Equipment Market Size by country (2018-2030) (Million US$)
Table 21. Europe Thin Wafer Processing and Dicing Equipment Market share by country (2018-2030)
Table 22. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Size by Equipment Type (2018-2030) (Million US$)
Table 23. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Share by Equipment Type (2018-2030)
Table 24. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Size by Application (2018-2030) (Million US$)
Table 25. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Share by Application (2018-2030)
Table 26. APAC Thin Wafer Processing and Dicing Equipment Market Size by country (2018-2030) (Million US$)
Table 27. APAC Thin Wafer Processing and Dicing Equipment Market share by country (2018-2030)
Table 28. South America Thin Wafer Processing and Dicing Equipment Market Size by Equipment Type (2018-2030) (Million US$)
Table 29. South America Thin Wafer Processing and Dicing Equipment Market Share by Equipment Type (2018-2030)
Table 30. South America Thin Wafer Processing and Dicing Equipment Market Size by Application (2018-2030) (Million US$)
Table 31. South America Thin Wafer Processing and Dicing Equipment Market Share by Application (2018-2030)
Table 32. South America Thin Wafer Processing and Dicing Equipment Market Size by country (2018-2030) (Million US$)
Table 33. South America Thin Wafer Processing and Dicing Equipment Market share by country (2018-2030)
Table 34. The Middle-East & Africa Thin Wafer Processing and Dicing Equipment Market Size by Equipment Type (2018-2030) (Million US$)
Table 35. The Middle-East & Africa Thin Wafer Processing and Dicing Equipment Market Share by Equipment Type (2018-2030)
Table 36. The Middle-East & Africa Thin Wafer Processing and Dicing Equipment Market Size by Application (2018-2030) (Million US$)
Table 37. The Middle-East & Africa Thin Wafer Processing and Dicing Equipment Market Share by Application (2018-2030)
Table 38. The MEA Thin Wafer Processing and Dicing Equipment Market Size by country (2018-2030) (Million US$)
Table 39. The MEA Thin Wafer Processing and Dicing Equipment Market share by country (2018-2030)
Table 40. EV Group Details
Table 41. Business Overview
Table 42. Equipment Types & services
Table 43. Financial Overview (2018-2030) (Million US$)
Table 44. Recent Development
Table 45. UTAC Holdingy Details
Table 46. Business Overview
Table 47. Equipment Types & services
Table 48. Financial Overview (2018-2030) (Million US$)
Table 49. Recent Development
Table 50. SPTS Technologies Ltd Company Details
Table 51. Business Overview
Table 52. Equipment Types & services
Table 53. Financial Overview (2018-2030) (Million US$)
Table 54. Recent Development
Table 55. Global Thin Wafer Processing and Dicing Equipment Revenue by Players (2021) (Million US$)
Table 56. Global Thin Wafer Processing and Dicing Equipment Market Share by Players (2021)

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LIST OF FIGURES

Figure 1. Global Thin Wafer Processing and Dicing Equipment Market Share by Equipment Type in 2021 & 2028
Figure 2. Global Thin Wafer Processing and Dicing Equipment Market Share by Application in 2021 & 2028
Figure 3. Thin Wafer Processing and Dicing Equipment Report Years Considered
Figure 4. Global Thin Wafer Processing and Dicing Equipment Market Size and Growth Rate 2018-2030 (Million US$)
Figure 5. Porter's Five Forces Analysis
Figure 6. Global Thin Wafer Processing and Dicing Equipment Market Size by Equipment Type Growth Rate 2018-2030 (Million US$)
Figure 7. Global Thin Wafer Processing and Dicing Equipment Market Size by Application Growth Rate 2018-2030 (Million US$)
Figure 8. North America Thin Wafer Processing and Dicing Equipment Market Size 2018-2030 (Million US$)
Figure 9. Europe Thin Wafer Processing and Dicing Equipment Market Size 2018-2030 (Million US$)
Figure 10. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Size 2018-2030 (Million US$)
Figure 11. South America Thin Wafer Processing and Dicing Equipment Market Size 2018-2030 (Million US$)
Figure 12. The Middle-East & Africa Thin Wafer Processing and Dicing Equipment Market Size 2018-2030 (Million US$)
Figure 1. EV Group Revenue in (2019-2021)
Figure 2. Revenue Growth Rate (2018-2030)
Figure 3. Revenue Growth Rate in (2018-2030)
Figure 4. Global Thin Wafer Processing and Dicing Equipment Market Share by Players in 2021

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