This report describes the global market size of Thin Wafer Processing and Dicing Equipment Market from 2018 to 2022 and its CAGR from 2018 to 2022, and also forecasts its market size to the end of 2030 and its expected to grow with a CAGR of 15.3% from 2023 to 2030.
Thin wafer processing and dicing equipment is a Equipment Type of semiconductor manufacturing equipment that is used to process and dice thin wafers. Thin wafers are typically used for applications where size and weight are important, such as in mobile devices and wearable electronics.
Thin wafer processing and dicing equipment typically includes the following components:
Wafer thinning equipment: This equipment is used to reduce the thickness of the wafer. This is done by removing material from the back of the wafer.
Wafer polishing equipment: This equipment is used to smooth the surface of the wafer after it has been thinned. This is important to ensure that the wafer is flat and free of defects.
Dicing equipment: This equipment is used to cut the wafer into individual chips. This is done by using a blade or laser to create a series of cuts in the wafer.
Due to the COVID-19 pandemic and Russia-Ukraine War Influence, the global market for Thin Wafer Processing and Dicing Equipment Market estimated at US $ million in the year 2022, is projected to reach a revised size of US$ million by 2030, growing at a CAGR of 15.3% during the forecast period 2023-2030. North American market for Thin Wafer Processing and Dicing Equipment Market is estimated to increase from $million in 2022 to reach $ million by 2030, at a CAGR of XX% during the forecast period of 2023 through 2030.
For geography segment, regional supply, demand, major players, price is presented from 2018 to 2030. This report cover following regions:
Middle East and Africa
The key countries for each regions are also included such as United States, China, Japan, India, Korea, ASEAN, Germany, France, UK, Italy, Spain, CIS, and Brazil etc.
For competitor segment, the report include global key players of Thin Wafer Processing and Dicing Equipment Market as well as some small players. The information for each competitor include:
Main Business Information
Sales Volume, Revenue, Price and Gross Margin
By Equipment Type
Categorized by the type of equipment, the market is segmented into thinning equipment and dicing equipment. Within this classification, the dicing equipment segment emerged as the foremost source of revenue for the market throughout the forecast period.
Memory and Logic
CMOS Image Sensors
The market is divided into memory and logic segments based on application. Micro Electro Mechanical Systems (MEMS) devices, power devices, CMOS image sensors, and Radio Frequency Identification (RFID) devices are all accessible via Silicon Via (TSV). Within these applications, the memory and logic segment held the predominant position as the primary revenue contributor within the thin wafer processing and dicing equipment market forecast.
BY Wafer Size
Less than 4 inch
5 inch and 6 inch
Categorized by wafer size, the market is segmented into sizes below 4-inch, 5-inch, 6-inch, 8-inch, and 12-inch. Among these, the 5-inch and 6-inch segments stood out as the primary sources of revenue in the analysis of the thin wafer processing and dicing equipment market.
By Dicing Technology
Categorized by Dicing Technology, the market is segmented into Blade Dicing, Laser Dicing, Plasma Dicing, Stealth Dicing. Among these, the Blade Dicing segment stood out as the primary sources of revenue in the analysis of the thin wafer processing and dicing equipment market
By Wafer Thickness
Categorized by Wafer Thickness, the market is segmented into 750 micrometers, 120 micrometers, 50 micrometers. Among these, 750 micrometers segment stood out as the primary sources of revenue in the analysis of the thin wafer processing and dicing equipment market
Middle East & Africa
In terms of geographical distribution, the analysis of trends in the thin wafer processing and dicing equipment market encompasses North America (including the U.S., Canada, and Mexico), Europe (encompassing the UK, Germany, France, and the broader European region), Asia-Pacific (encompassing China, Japan, India, South Korea, and other parts of the Asia-Pacific area), and LAMEA (covering Latin America, the Middle East, and Africa). Notably, the Asia-Pacific region, particularly the remaining areas of Asia-Pacific, maintains a significant role as a participant in the global thin wafer processing and dicing equipment industry.
SPTS Technologies Ltd
Neon Tech ltd
Lam Research Corp
Suzhou Delphi Laser Co.ltd
Other Key players
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Base Year: 2022
Historical Data: from 2018 to 2021
Forecast Data: from 2023 to 2030
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